Location: Home > Other information > pogo pin > 
spring thimble pogo pin

The high requirements of pogopin pogo pin production process

source:pogo pin release time:2021-08-26 Article author:sznbone Popular:POGO PIN

  The pogopin pogo pin production process is related to the rationality and practicability of electronic products. On the current road of vigorously developing electronic technology, the requirements for the internal parts of the equipment are also very strict. The pogo pin is widely used in semiconductor equipment. The parts in it play the role of connecting circuits or transmitting signals.

Spring probe M001 1.5x4.6

  Because many devices are often used in some harsh natural environments, in order to ensure environmental applications in various situations, when pogopin pogo pins are produced, the surface layer is generally gold-plated, which can better improve its anti-corrosion performance and electrical performance. , Mechanical properties, etc., to ensure stable operation in the equipment. In some high and low temperature, salt spray, temperature and humidity scenarios, it is easy to cause problems such as pin stuck and disconnection of the internal connector. Therefore, it is essential to test the application performance of the external environment when producing pogo pins.


Read recommendations:

M1783 2.0x7.2(1A)

High current probe M1962 1.9X7.8(2.5A)

Spring probe

The structure of FPC cable connector

poor quality of common pogo pin

86-755-89900596