Probe head rapidly increases WLCSP test throughput

　　To keep up with the fast pace of mobile phone development, chip suppliers must launch new chips as cheaply as possible, in less time and on schedule. In the process, chip suppliers must overcome various test challenges and quickly bring WLCSP devices to mass production on schedule. The test head (Probe Head) is an important link connecting the WCLSP device and the ATE test equipment.

　　To maximize ROI, chipmakers must choose a product that can satisfy both the engineering pilot phase and the production phase test structure. Because the steps of chip process testing are sequential, the ideal structure of the selected test product is one that allows it to be flexibly switched between multiple conditions, from single-station to multi-station, from a single device to an entire wafer Round phase testing, and from validation/debug to production testing. Reusing test hardware in these different test applications can save a lot of money.

　　One of the most important aspects when developing probe heads for WLCSP test applications is ensuring that the hardware is delivered on time, every time. Once the package size is known and the multi-station test layout is determined, the test engineering team must quickly start the probe head design project, produce it in time, and deliver it. For the WLCSP test engineering team, the biggest challenge was choosing a product that could support both individual device testing needs and full wafer-level testing needs. In the research and development stage, customers usually hope to get the chip for testing and verification as soon as possible. Therefore, in many cases, customers will source single devices from the fab that are cut from MPWs (multi-product wafers), making the single device die the first device to arrive in the lab.

　　To test these devices, test engineers must use a probe head to quickly configure manual tests, which can test one or more devices simultaneously. It should be noted that during testing, a manual test lid (lid) must be used to press the device onto the probe head, and the electrical performance of this test setup must be nearly identical to the entire wafer level package. At the same time, before the mass production test of the whole wafer, the production efficiency of the mass production stage can be greatly improved by debugging the signal path of each station on the multi-station.

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